● Product Line information                                      
                                           
VS-Tech thermal interface material mainly include GAP Pad and Thermally coonductive paste.                                       
Our Gap pad is designed to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. They are very conformable, filled silicone rubber material and has 1.0-6.0 w/m-k conductivity grades; it is easy to fill in air gaps between PC board and heat sinks or a metal chassis.                     Also our thermal Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance. It can also be with specific coating becoming single side tacky to allow easy material handling and installation.                                       
Thermally conductive paste is the most common material used in systems and devices for thermal management.Main criteria for choosing thermally conductive paste are the thermal properties as well as the processing capacities.                 Thermal conductive paste builts a thin binding film for very good thermal conductivity through the low thermal resistance.                                     
                                           

●  Product Properties                                      

◎     Very good thermal properties                
◎     Available as die cut gasket or standard sheet
◎     Thermal conductivity from 1.0 W/m*k to 6.0 W/m*k possible sticky on one side or   both sides with suffix A
◎     RoHS Compliance
◎     Some products are available on fiber glass carrier with suffix G      

 

● Applications       

◎     Cooling components to chassis, frame, or other mating components
◎     Memory modules
◎     Home and small office network equipment
◎     Mass storage devices
◎     Automotive electronics
◎     Telecommunication hardware
◎     Radios
◎     LED solid state lighting
◎     Power electronics
◎     LCD and PDP flat panel
◎     IT infrastructure